Siracusa: A 16 nm Heterogenous RISC-V SoC for Extended Reality With At-MRAM Neural Engine

  • Arpan Suravi Prasad*
  • , Moritz Scherer
  • , Francesco Conti
  • , Davide Rossi
  • , Alfio Di Mauro
  • , Manuel Eggimann
  • , Jorge Tomas Gomez
  • , Ziyun Li
  • , Syed Shakib Sarwar
  • , Zhao Wang
  • , Barbara De Salvo
  • , Luca Benini
  • *Autor correspondiente de este trabajo

Producción científica: Contribución a una revistaArtículorevisión exhaustiva

12 Citas (Scopus)

Resumen

Extended reality (XR) applications are machine learning (ML)-intensive, featuring deep neural networks (DNNs) with millions of weights, tightly latency-bound (10-20 ms end-to-end), and power-constrained (low tens of mW average power). While ML performance and efficiency can be achieved by introducing neural engines within low-power systems-on-chip (SoCs), system-level power for nontrivial DNNs depends strongly on the energy of non-volatile memory (NVM) access for network weights. This work introduces Siracusa, a near-sensor heterogeneous SoC for next-generation XR devices manufactured in 16 nm CMOS. Siracusa couples an octa-core cluster of RISC-V digital signal processing (DSP) cores with a novel tightly coupled 'At-Memory' integration between a state-of-the-art digital neural engine called N-EUREKA and an on-chip NVM based on magnetoresistive random access memory (MRAM), achieving 1.7× higher throughput and 3× better energy efficiency than XR SoCs using NVM as background memory. The fabricated SoC prototype achieves an area efficiency of 65.2 GOp/s/mm2 and a peak energy efficiency of 8.84 TOp/J for DNN inference while supporting complex, heterogeneous application workloads, which combine ML with conventional signal processing and control.

Idioma originalInglés
Páginas (desde-hasta)2055-2069
Número de páginas15
PublicaciónIEEE Journal of Solid-State Circuits
Volumen59
N.º7
DOI
EstadoPublicada - 1 jul. 2024

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