Modular Multilevel Series-Parallel Converter with Parallel-Connected Phases and Coupled Inductors for High-Current Applications

Esteban Concha, Sebastian Rivera, Apparao Dekka, F. Ricardo Lizana

Producción científica: Capítulo del libro/informe/acta de congresoContribución a la conferenciarevisión exhaustiva

Resumen

Modular multilevel series-parallel converters (MM-SPC) have become a suitable solution to provide higher operating voltages, fault tolerance operation, and reliability at a reduced cost, due to their ability to achieve a simpler internal voltage balance. Therefore, MMSPC is a promising solution for applications where the nominal operating conditions are high voltage levels on the DC side and high current ratings on the AC side of the system. To allow this operation, it is necessary to design the system with parallelization in each phase. Therefore, this article proposes a design that incorporates parallelization in each phases and analyzes the internal cross-circulating current generated due to parallelization. This current creates an unbalance and internal losses in the converter. In order to compensate for the cross-circulating current, two cases are compared: the first one with decoupled inductors in their phases, and the second one with coupled inductors. This way, a comparison is made to determine which case provides greater compensation of the circulating current, allowing for the delivery of a high current at the converter's output with the least possible imbalance and internal losses.

Idioma originalInglés
Título de la publicación alojadaChileCon 2023 - 2023 IEEE CHILEAN Conference on Electrical, Electronics Engineering, Information and Communication Technologies
EditorialInstitute of Electrical and Electronics Engineers Inc.
ISBN (versión digital)9798350369533
DOI
EstadoPublicada - 2023
Publicado de forma externa
Evento2023 IEEE CHILEAN Conference on Electrical, Electronics Engineering, Information and Communication Technologies, ChileCon 2023 - Hybrid, Valdivia, Chile
Duración: 5 dic. 20237 dic. 2023

Serie de la publicación

NombreProceedings - IEEE CHILEAN Conference on Electrical, Electronics Engineering, Information and Communication Technologies, ChileCon
ISSN (versión impresa)2832-1529
ISSN (versión digital)2832-1537

Conferencia

Conferencia2023 IEEE CHILEAN Conference on Electrical, Electronics Engineering, Information and Communication Technologies, ChileCon 2023
País/TerritorioChile
CiudadHybrid, Valdivia
Período5/12/237/12/23

Nota bibliográfica

Publisher Copyright:
© 2023 IEEE.

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