Resumen
Modular multilevel series-parallel converters (MM-SPC) have become a suitable solution to provide higher operating voltages, fault tolerance operation, and reliability at a reduced cost, due to their ability to achieve a simpler internal voltage balance. Therefore, MMSPC is a promising solution for applications where the nominal operating conditions are high voltage levels on the DC side and high current ratings on the AC side of the system. To allow this operation, it is necessary to design the system with parallelization in each phase. Therefore, this article proposes a design that incorporates parallelization in each phases and analyzes the internal cross-circulating current generated due to parallelization. This current creates an unbalance and internal losses in the converter. In order to compensate for the cross-circulating current, two cases are compared: the first one with decoupled inductors in their phases, and the second one with coupled inductors. This way, a comparison is made to determine which case provides greater compensation of the circulating current, allowing for the delivery of a high current at the converter's output with the least possible imbalance and internal losses.
Idioma original | Inglés |
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Título de la publicación alojada | ChileCon 2023 - 2023 IEEE CHILEAN Conference on Electrical, Electronics Engineering, Information and Communication Technologies |
Editorial | Institute of Electrical and Electronics Engineers Inc. |
ISBN (versión digital) | 9798350369533 |
DOI | |
Estado | Publicada - 2023 |
Publicado de forma externa | Sí |
Evento | 2023 IEEE CHILEAN Conference on Electrical, Electronics Engineering, Information and Communication Technologies, ChileCon 2023 - Hybrid, Valdivia, Chile Duración: 5 dic. 2023 → 7 dic. 2023 |
Serie de la publicación
Nombre | Proceedings - IEEE CHILEAN Conference on Electrical, Electronics Engineering, Information and Communication Technologies, ChileCon |
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ISSN (versión impresa) | 2832-1529 |
ISSN (versión digital) | 2832-1537 |
Conferencia
Conferencia | 2023 IEEE CHILEAN Conference on Electrical, Electronics Engineering, Information and Communication Technologies, ChileCon 2023 |
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País/Territorio | Chile |
Ciudad | Hybrid, Valdivia |
Período | 5/12/23 → 7/12/23 |
Nota bibliográfica
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