TY - JOUR
T1 - A universal adhesive containing copper nanoparticles improves the stability of hybrid layer in a cariogenic oral environment
T2 - An in situ study
AU - Vidal, Omar
AU - de Paris Matos, Thalita
AU - Núñez, Alejandra
AU - Méndez-Bauer, Luján
AU - Sutil, Elisama
AU - Ñaupari-Villasante, Romina
AU - Souta, Melissa Caroline
AU - Pitlovanciv, Murilo
AU - Gutiérrez, Mario F.
AU - Loguercio, Alessandro D.
N1 - Funding Information:
This study was performed by Omar Vidal as partial fulfillment of his Master of Science degree at the State University of Ponta Grossa (UEPG), Ponta Grossa, PR, Brazil. This work was partially supported by the National Council for Scientific and Technological Development (CNPq) [grant 308286/2019-7 ] and by Coordenação de Aperfeiçoamento de Pessoal de Nível Superior (CAPES) [Finance Code 001 ] (Brazilian agencies). The authors are grateful for the technical support of the interdisciplinary laboratory CLABMU of State University of Ponta Grossa. The authors would like to thanks to Mr. Juan Fernández de los Ríos, from the Language and Translation services, Direction of Academic Affairs, Faculty of Dentistry, Universidad de Chile, for kindly proofreading and checking the spelling and grammar of this article.
Funding Information:
This study was performed by Omar Vidal as partial fulfillment of his Master of Science degree at the State University of Ponta Grossa (UEPG), Ponta Grossa, PR, Brazil. This work was partially supported by the National Council for Scientific and Technological Development (CNPq) [grant 308286/2019-7] and by Coordena??o de Aperfei?oamento de Pessoal de N?vel Superior (CAPES) [Finance Code 001] (Brazilian agencies). The authors are grateful for the technical support of the interdisciplinary laboratory CLABMU of State University of Ponta Grossa. The authors would like to thanks to Mr. Juan Fern?ndez de los R?os, from the Language and Translation services, Direction of Academic Affairs, Faculty of Dentistry, Universidad de Chile, for kindly proofreading and checking the spelling and grammar of this article.
Publisher Copyright:
© 2021 Elsevier Ltd
PY - 2022/2
Y1 - 2022/2
N2 - Purpose: To evaluate how incorporating copper nanoparticles (CuNp) into a universal adhesive affects the antimicrobial activity (AMA), bond strength (μTBS), nanoleakage (NL), elastic modulus (EM) and nanohardness (NH) of resin–dentin interfaces, at 24 h (24 h) and after in situ cariogenic challenge (CC). Methods: CuNp (0% [control] and 0.1 wt%) was added to an adhesive. After enamel removal, the adhesives were applied to dentine surfaces. Each restored tooth was sectioned longitudinally to obtain two hemi-teeth; one of them was evaluated after 24 h, and the other was included in one of the intra-oral palatal devices placed in the mouths of 10 volunteers for 14 days in CC. After that, each hemi-tooth was removed, and any oral biofilm that formed was collected. The AMA was evaluated against Streptococcus mutans. For the 24 h and CC groups, each hemi-tooth was sectioned in the “x” direction to obtain one slice for each EM/NH evaluation. The remains of each hemi-tooth were sectioned in the “x” and “y" directions to obtain resin-dentin beams for μTBS and NL evaluation (24 h and CC). ANOVA and Tukey's test were applied (α = 0.05). Results: The presence of CuNp significantly improved AMA as well as all of the evaluated properties (24 h; p < 0.05). Although the adhesive properties (μTBS/NL) for all groups decreased after CC (p < 0.05), the adhesive containing CuNp showed higher μTBS and lower NL as compared to the copper-free adhesive (p < 0.05). The incorporation of CuNp maintained NH/EM values after CC (p < 0.05). Conclusions: Adding 0.1% CuNp to an adhesive may provide antimicrobial activity and increase its bonding and mechanical properties, even under a cariogenic challenge. Significance: This is the first in situ study proving that incorporating CuNp into an adhesive is an achievable alternative to provide antimicrobial properties and improve the integrity of the hybrid layer under in situ cariogenic challenge.
AB - Purpose: To evaluate how incorporating copper nanoparticles (CuNp) into a universal adhesive affects the antimicrobial activity (AMA), bond strength (μTBS), nanoleakage (NL), elastic modulus (EM) and nanohardness (NH) of resin–dentin interfaces, at 24 h (24 h) and after in situ cariogenic challenge (CC). Methods: CuNp (0% [control] and 0.1 wt%) was added to an adhesive. After enamel removal, the adhesives were applied to dentine surfaces. Each restored tooth was sectioned longitudinally to obtain two hemi-teeth; one of them was evaluated after 24 h, and the other was included in one of the intra-oral palatal devices placed in the mouths of 10 volunteers for 14 days in CC. After that, each hemi-tooth was removed, and any oral biofilm that formed was collected. The AMA was evaluated against Streptococcus mutans. For the 24 h and CC groups, each hemi-tooth was sectioned in the “x” direction to obtain one slice for each EM/NH evaluation. The remains of each hemi-tooth were sectioned in the “x” and “y" directions to obtain resin-dentin beams for μTBS and NL evaluation (24 h and CC). ANOVA and Tukey's test were applied (α = 0.05). Results: The presence of CuNp significantly improved AMA as well as all of the evaluated properties (24 h; p < 0.05). Although the adhesive properties (μTBS/NL) for all groups decreased after CC (p < 0.05), the adhesive containing CuNp showed higher μTBS and lower NL as compared to the copper-free adhesive (p < 0.05). The incorporation of CuNp maintained NH/EM values after CC (p < 0.05). Conclusions: Adding 0.1% CuNp to an adhesive may provide antimicrobial activity and increase its bonding and mechanical properties, even under a cariogenic challenge. Significance: This is the first in situ study proving that incorporating CuNp into an adhesive is an achievable alternative to provide antimicrobial properties and improve the integrity of the hybrid layer under in situ cariogenic challenge.
KW - Copper
KW - In situ
KW - Microtensile bond strength
KW - Nanoleakage
KW - Nanoparticles
KW - Universal adhesive system
UR - http://www.scopus.com/inward/record.url?scp=85120745757&partnerID=8YFLogxK
UR - https://www.mendeley.com/catalogue/14671b10-09d0-3ff7-b197-eb352e55d2d3/
U2 - 10.1016/j.jmbbm.2021.105017
DO - 10.1016/j.jmbbm.2021.105017
M3 - Article
AN - SCOPUS:85120745757
SN - 1751-6161
VL - 126
SP - 1
EP - 9
JO - Journal of the Mechanical Behavior of Biomedical Materials
JF - Journal of the Mechanical Behavior of Biomedical Materials
M1 - 105017
ER -