TY - JOUR
T1 - 18-month clinical evaluation of a copper-containing universal adhesive in non-carious cervical lesions
T2 - A double-blind, randomized controlled trial
AU - Matos, Thalita P.
AU - Gutiérrez, Mario F.
AU - Hanzen, Taise A.
AU - Malaquias, Pâmela
AU - de Paula, Alexandra M.
AU - de Souza, Jullian J.
AU - Hass, Viviane
AU - Fernández, Eduardo
AU - Reis, Alessandra
AU - Loguercio, Alessandro D.
N1 - Funding Information:
This study was performed by Thalita de Paris Matos as partial fulfillment of his MSc degree at the State University of Ponta Grossa (UEPG), Ponta Grossa, PR, Brazil. This study was partially supported by the National Council for Scientific and Technological Development (CNPq) under grants 305588/2014-1 , 303332/2017-4 and in part by the Coordenação de Aperfeiçoamento de Pessoal de Nível Superior - Brasil (CAPES) - Finance Code 001 and by the Fondecyt under grant 1170575 – Chile.
Publisher Copyright:
© 2019 Elsevier Ltd
PY - 2019/11
Y1 - 2019/11
N2 - Objective: This study aimed to evaluate the addition of copper nanoparticles (CuNp) on the clinical performance of a universal adhesive system used as etch-and-rinse (ER) and self-etch (SE). Methods: 216 restorations were randomly placed in 36 subjects according to the following groups: ERcu = etch-and-rinse with 0.1% CuNp; ERct = etch-and-rinse without CuNp; SEcu = self-etch with 0.1% CuNp; SEct = self-etch without CuNp. Resin composite was placed incrementally and light-cured. The restorations were evaluated at baseline and 6, 12 and 18 months using the FDI and USPHS criteria. Statistical analyses were performed using appropriate tests (α = 0.05). Results: The addition of CuNp did not increase the clinical performance (FDI / USPHS) of the universal adhesive tested after 18-month when applied in the ER mode (p > 0.05). The addition of CuNp in SE restorations increased the retention rate significantly and decreased the marginal discrepancies after 18 months (p < 0.05). Conclusion: The clinical performance of universal adhesive was significantly increased when applied in the SE mode with the addition of copper nanoparticles. Clinical relevance: This is the first study that demonstrates a slight improvement in the clinical performance of universal adhesive systems in non-carious cervical lesions when added CuNp in lower concentration.
AB - Objective: This study aimed to evaluate the addition of copper nanoparticles (CuNp) on the clinical performance of a universal adhesive system used as etch-and-rinse (ER) and self-etch (SE). Methods: 216 restorations were randomly placed in 36 subjects according to the following groups: ERcu = etch-and-rinse with 0.1% CuNp; ERct = etch-and-rinse without CuNp; SEcu = self-etch with 0.1% CuNp; SEct = self-etch without CuNp. Resin composite was placed incrementally and light-cured. The restorations were evaluated at baseline and 6, 12 and 18 months using the FDI and USPHS criteria. Statistical analyses were performed using appropriate tests (α = 0.05). Results: The addition of CuNp did not increase the clinical performance (FDI / USPHS) of the universal adhesive tested after 18-month when applied in the ER mode (p > 0.05). The addition of CuNp in SE restorations increased the retention rate significantly and decreased the marginal discrepancies after 18 months (p < 0.05). Conclusion: The clinical performance of universal adhesive was significantly increased when applied in the SE mode with the addition of copper nanoparticles. Clinical relevance: This is the first study that demonstrates a slight improvement in the clinical performance of universal adhesive systems in non-carious cervical lesions when added CuNp in lower concentration.
KW - Clinical trial
KW - Copper nanoparticles
KW - Longevity
KW - Non-carious cervical lesion
KW - Universal adhesive system
UR - http://www.scopus.com/inward/record.url?scp=85074427025&partnerID=8YFLogxK
U2 - 10.1016/j.jdent.2019.103219
DO - 10.1016/j.jdent.2019.103219
M3 - Article
C2 - 31629030
AN - SCOPUS:85074427025
SN - 0300-5712
VL - 90
JO - Journal of Dentistry
JF - Journal of Dentistry
M1 - 103219
ER -