Zinc oxide and copper nanoparticles addition in universal adhesive systems improve interface stability on caries-affected dentin

Mario Felipe Gutiérrez, J. Bermudez, Andrés Dávila-Sánchez, Luisa F. Alegría-Acevedo, Luján Méndez-Bauer, Marcela Hernández, Jessica Astorga, Alessandra Reis, Alessandro D. Loguercio, Paulo V. Farago, Eduardo Fernández

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4 Scopus citations

Abstract

This study evaluated the MMP inhibition of the zinc oxide and copper nanoparticles (ZnO/CuNp), and the effects of their addition into adhesives on antimicrobial activity (AMA), ultimate tensile strength (UTS), in vitro degree of conversion (in vitro-DC), as well as, resin–dentin bond strength (μTBS), nanoleakage (NL) and in situ-DC on caries-affected dentin. Anti-MMP activity was evaluated for several MMPs. ZnO/CuNp (0% [control]; 5/0.1 and 5/0.2 wt%) were added into Prime&Bond Active (PBA) and Ambar Universal (AMB). The AMA was evaluated against Streptococcus mutans. UTS were tested after 24 h and 28d. After induced caries, adhesives and composite were applied to flat dentin surfaces, and specimens were sectioned to obtain resin–dentin sticks. μTBS, NL, in vitro-DC and in situ-DC were evaluated after 24 h. ANOVA and Tukey's test were applied (α = 0.05). ZnO/CuNp demonstrated anti-MMP activity (p < 0.05). The addition of ZnO/CuNp increased AMA and UTS (AMB; p < 0.05). UTS for PBA, in vitro-DC, in situ-DC and μTBS for both adhesives were maintained with ZnO/CuNp (p > 0.05). However, lower NL was observed for ZnO/CuNp groups (p < 0.05). The addition of ZnO/CuNp in adhesives may be an alternative to provide antimicrobial, anti-MMP activities and improves the integrity of the hybrid layer on caries-affected dentin.

Original languageEnglish
Article number103366
JournalJournal of the Mechanical Behavior of Biomedical Materials
Volume100
DOIs
StatePublished - Dec 2019
Externally publishedYes

Bibliographical note

Funding Information:
This study was performed by Mario Felipe Gutiérrez Reyes as partial fulfillment of his PhD degree at the State University of Ponta Grossa (UEPG), Ponta Grossa, PR, Brazil. This project was supported by Fondecyt (Fondo Nacional de Desarrollo Científico y Tecnológico - Chile) project 1170575 (Chile; EF). Also, this study was partially supported by the National Council for Scientific and Technological Development ( CNPq ) under grants 305588/2014-1 (Brazil; ADL) and in part by the Coordenação de Aperfeiçoamento de Pessoal de Nível Superior - Brasil (CAPES) - Finance Code 001 .

Funding Information:
This study was performed by Mario Felipe Guti?rrez Reyes as partial fulfillment of his PhD degree at the State University of Ponta Grossa (UEPG), Ponta Grossa, PR, Brazil. This project was supported by Fondecyt (Fondo Nacional de Desarrollo Cient?fico y Tecnol?gico - Chile) project 1170575 (Chile; EF). Also, this study was partially supported by the National Council for Scientific and Technological Development (CNPq) under grants 305588/2014-1 (Brazil; ADL) and in part by the Coordena??o de Aperfei?oamento de Pessoal de N?vel Superior - Brasil (CAPES) - Finance Code 001.

Publisher Copyright:
© 2019 Elsevier Ltd

Keywords

  • Copper
  • Microtensile bond strength
  • Nanoleakage
  • Nanoparticles
  • Universal adhesive system
  • Zinc oxide

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