Thermally Constrained Codesign of Heterogeneous 3-D Integration of Compute-in-Memory, Digital ML Accelerator, and RISC-V Cores for Mixed ML and Non-ML Workloads

Keyphrases

• Machine Learning 100%
• In-memory 100%
• RISC-V 100%
• Machine Learning Learning 100%
• Machine Learning Accelerator 100%
• 3D Integration 100%
• Virtual Reality 66%
• Augmented Reality 66%
• Thermal Latency 66%
• Thermal Power 66%
• Activity Rate 33%
• Cost Factors 33%
• Rate-based 33%
• Cooling Coefficient 33%
• Fabrication Cost 33%
• Heterogeneous Systems 33%
• Latency Constraint 33%
• Hardware Design 33%
• Power Trading 33%
• Thermal Constraint 33%
• Chip Form 33%
• Circ 33%
• Operating Point 33%
• Power Constraint 33%
• Modern Algorithms 33%
• Speedup Ratio 33%

Computer Science

• Digital Machine 100%
• Machine Learning 100%
• Learning System 100%
• Augmented Reality 33%
• Virtual Reality 33%
• Hardware Design 16%
• Power Constraint 16%
• Heterogeneous System 16%
• Operating Point 16%
• Computer Hardware 16%