Abstract
Extended reality (XR) applications are machine learning (ML)-intensive, featuring deep neural networks (DNNs) with millions of weights, tightly latency-bound (10-20 ms end-to-end), and power-constrained (low tens of mW average power). While ML performance and efficiency can be achieved by introducing neural engines within low-power systems-on-chip (SoCs), system-level power for nontrivial DNNs depends strongly on the energy of non-volatile memory (NVM) access for network weights. This work introduces Siracusa, a near-sensor heterogeneous SoC for next-generation XR devices manufactured in 16 nm CMOS. Siracusa couples an octa-core cluster of RISC-V digital signal processing (DSP) cores with a novel tightly coupled 'At-Memory' integration between a state-of-the-art digital neural engine called N-EUREKA and an on-chip NVM based on magnetoresistive random access memory (MRAM), achieving 1.7× higher throughput and 3× better energy efficiency than XR SoCs using NVM as background memory. The fabricated SoC prototype achieves an area efficiency of 65.2 GOp/s/mm2 and a peak energy efficiency of 8.84 TOp/J for DNN inference while supporting complex, heterogeneous application workloads, which combine ML with conventional signal processing and control.
| Original language | English |
|---|---|
| Pages (from-to) | 2055-2069 |
| Number of pages | 15 |
| Journal | IEEE Journal of Solid-State Circuits |
| Volume | 59 |
| Issue number | 7 |
| DOIs | |
| State | Published - 1 Jul 2024 |
Bibliographical note
Publisher Copyright:© 1966-2012 IEEE.
UN SDGs
This output contributes to the following UN Sustainable Development Goals (SDGs)
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SDG 7 Affordable and Clean Energy
Keywords
- Artificial intelligence (AI)
- RISC-V
- augmented reality (AR)
- deep neural network (DNN)
- extended reality (XR)
- heterogeneous architecture
- magnetoresistive random access memory (MRAM)
- non-volatile memory (NVM)
- system-on-chip (SoC)
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