Mechanical and microbiological properties and drug release modeling of an etch-and-rinse adhesive containing copper nanoparticles

M. F. Gutiérrez, P. Malaquias, T. P. Matos, A. Szesz, S. Souza, J. Bermudez, A. Reis, A. D. Loguercio*, P. V. Farago

*Corresponding author for this work

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