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Exploring MRAM for On-Chip Texture Storage in Rendering Applications

  • Nicolas Villegas*
  • , Stefano Romanini
  • , Moritz Scherer
  • , Warren Hunt
  • , Syed Shakib Sarwar
  • , Barbara De Salvo
  • , Chiao Liu
  • , Francesco Conti
  • , Davide Rossi
  • , Luca Benini
  • , Jorge Gómez
  • *Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

In recent years, Magnetoresistive Random-Access Memory (MRAM) has attracted considerable attention as a high-density, non-volatile alternative to conventional embedded memory technologies. While MRAM has been recently adopted for storing neural network weights, its application in rendering workloads remains unexplored. In this study, we investigate the potential of MRAM for on-chip texture storage within a tile-based rasterization workload. Leveraging Siracusa, a RISC-V-based System-on-Chip (SoC) that integrates both MRAM and SRAM at the same memory hierarchy level, we conduct a comparative evaluation focusing on latency and energy consumption across varying frame rates. The results suggest that MRAM achieves substantial energy savings at lower frame rates due to its ability to enter deep-sleep mode between rendering cycles. However, this benefit diminishes as frame rates increase, with SRAM becoming more energy-efficient beyond a threshold of 43 frames per second. These findings demonstrate that MRAM is particularly wellsuited to read-intensive, energy-constrained rendering tasks.

Original languageEnglish
Title of host publication2025 IFIP/IEEE 33rd International Conference on Very Large Scale Integration, VLSI-SoC 2025
PublisherIEEE Computer Society
ISBN (Electronic)9798331598129
DOIs
StatePublished - 2025
Event33rd IFIP/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2025 - Puerto Varas, Chile
Duration: 12 Oct 202515 Oct 2025

Publication series

NameIEEE/IFIP International Conference on VLSI and System-on-Chip, VLSI-SoC
ISSN (Print)2324-8432
ISSN (Electronic)2324-8440

Conferencia o congreso

Conferencia o congreso33rd IFIP/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2025
Country/TerritoryChile
CityPuerto Varas
Period12/10/2515/10/25

Bibliographical note

Publisher Copyright:
© 2025 IEEE.

UN SDGs

This output contributes to the following UN Sustainable Development Goals (SDGs)

  1. SDG 7 - Affordable and Clean Energy
    SDG 7 Affordable and Clean Energy

Keywords

  • Emerging Memories
  • High-density memories
  • MRAM
  • Non-Volatile memories
  • SAHbased BVH rasterization
  • Tile-based rendering

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