Empty container stacking operations: Case study of an empty container depot in valparaiso chile

Felipe Hidalgo, Diego Aranda, Jimena Pascual, Alice E. Smith, Rosa G. Gonzalez-Ramirez

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

This paper describes a detailed stochastic simulation model integrated with a transactional database to model operations in an empty container depot. Empty container depots are found ubiquitously in supply chains around the world but there has been virtually no quantitative research done to assess operational policies nor layout designs. In this work we determine the performance of operational policies related to the stacking and retrieval of empty containers to derive recommendations for policy improvements and, in future work, the yard layout design. A simulation model was chosen as the proper tool to address these aims because of the uncertain nature and complex handling actions of an empty container depot. Results thus far show that policies concerning remarshalling and retrieval strongly influence the efficiency of the depot operations in terms of the truck turnaround times, as well as the utilization of the resources which include yard cranes and personnel.

Original languageEnglish
Title of host publication2017 Winter Simulation Conference, WSC 2017
EditorsVictor Chan
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages3114-3125
Number of pages12
ISBN (Electronic)9781538634288
ISBN (Print)0891-7736
DOIs
StatePublished - 28 Jun 2017
Event2017 Winter Simulation Conference, WSC 2017 - Las Vegas, United States
Duration: 3 Dec 20176 Dec 2017

Publication series

NameProceedings - Winter Simulation Conference
ISSN (Print)0891-7736

Conference

Conference2017 Winter Simulation Conference, WSC 2017
Country/TerritoryUnited States
CityLas Vegas
Period3/12/176/12/17

Bibliographical note

Funding Information:
This project was supported in part by CONICYT Chile, project MEC 80140051, and by the Fulbright Commission.

Publisher Copyright:
© 2017 IEEE.

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