Abstract
Augmented Reality (AR) will be the next great wave of human-oriented computing, dominating our relationship with the digital world for the next 50 years, much as personal computing has dominated the last 50 [1]. AR glasses require multiple cameras to enable all the computer vision (CV) and AI functions while operating under stringent weight, power, and socially acceptable form-factor constraints. The AR sensors need to be small, ultra-low power, with wide dynamic range (DR) and excellent low-light sensitivity to support day/night, indoor/outdoor, all-day wearable use cases. The combination of lowest power, best performance, and minimal form factor makes AR sensors the new frontier in the image sensors field. In this paper, we explore new sensor architectures and a distributed on-sensor compute system to solve these challenges.
Original language | English |
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Title of host publication | 2022 IEEE International Solid-State Circuits Conference, ISSCC 2022 |
Publisher | Institute of Electrical and Electronics Engineers Inc. |
Pages | 426-428 |
Number of pages | 3 |
ISBN (Electronic) | 9781665428002 |
DOIs | |
State | Published - 2022 |
Externally published | Yes |
Event | 2022 IEEE International Solid-State Circuits Conference, ISSCC 2022 - San Francisco, United States Duration: 20 Feb 2022 → 26 Feb 2022 |
Publication series
Name | Digest of Technical Papers - IEEE International Solid-State Circuits Conference |
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Volume | 2022-February |
ISSN (Print) | 0193-6530 |
Conference
Conference | 2022 IEEE International Solid-State Circuits Conference, ISSCC 2022 |
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Country/Territory | United States |
City | San Francisco |
Period | 20/02/22 → 26/02/22 |
Bibliographical note
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