A universal dental adhesive containing copper nanoparticles stabilizes the hybrid layer in eroded dentin after 1 year

Taíse Alessandra Hanzen, Mario Felipe Gutiérrez, Thalita de Paris Matos, Alexandra Mara de Paula, Fabiana Suelen Figueredo de Siqueira, Andrés Felipe Millán Cardenas, Andres Viteri-Garcia, Marcela Hernandez, Alessandro D. Loguercio*, Alessandra Reis

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

2 Scopus citations

Abstract

This study evaluated the matrix metalloproteases (MMP) inhibition of the copper nanoparticles (CuNp), and the effects of their addition into a universal adhesive system on antimicrobial activity (AMA), ultimate tensile strength (UTS), water sorption (WS), solubility (SO), as well as the 24h and 1y microtensile bond strength (μTBS), nanoleakage (NL) and in situ degree of conversion (DC), on sound and eroded dentin. Anti-MMP activity was evaluated for MMP-2, -8 and -9. CuNp (0%[control] and 0.1 wt%) were added into Ambar Universal. Antimicrobial activity against S. mutans was tested using agar diffusion. For UTS, specimens were tested after 24h and 28d. WS and SO were evaluated during 56d. After induced erosion, adhesives and composite were applied to flat dentin surfaces, and specimens were sectioned to obtain resin–dentin sticks, which were used for evaluation of μTBS and nanoleakage at the 24h and 1y periods. DC was evaluated at the 24h period in these beam-like specimens. Data were submitted to appropriate statistical analyses (α = 0.05). CuNp demonstrated anti MMP-activity (p < 0.05) besides providing antimicrobial activity (p < 0.05), as well as maintained stable μTBS and NL values over 1-year, for both substrates (p < 0.05). Thus, CuNp may prevent the degradation of the adhesive interface, mainly in eroded dentin. Clinical relevance: Copper-containing universal adhesives could be considered a feasible alternative to improve adhesive properties to sound and eroded dentin after 1-year.

Original languageEnglish
Article number103041
JournalInternational Journal of Adhesion and Adhesives
Volume113
DOIs
StatePublished - Mar 2022

Bibliographical note

Funding Information:
This study was partially supported by the National Council for Scientific and Technological Development (CNPq) , under grants 303332/2017–4 and 305588/2014–1 and the Coordination of Improvement of Higher-Level Personnel ( CAPES ).

Publisher Copyright:
© 2021 Elsevier Ltd

Keywords

  • Copper
  • Degree of conversion
  • Microtensile bond strength
  • Nanoleakage
  • Nanoparticles
  • Universal adhesive system

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