A universal adhesive containing copper nanoparticles improves the stability of hybrid layer in a cariogenic oral environment: An in situ study

Omar Vidal; Thalita de Paris Matos; Alejandra Núñez; Luján Méndez-Bauer; Elisama Sutil; Romina Ñaupari-Villasante; Melissa Caroline Souta; Murilo Pitlovanciv; Mario F. Gutiérrez; Alessandro D. Loguercio

doi:10.1016/j.jmbbm.2021.105017

A universal adhesive containing copper nanoparticles improves the stability of hybrid layer in a cariogenic oral environment: An in situ study

Omar Vidal, Thalita de Paris Matos, Alejandra Núñez, Luján Méndez-Bauer, Elisama Sutil, Romina Ñaupari-Villasante, Melissa Caroline Souta, Murilo Pitlovanciv, Mario F. Gutiérrez, Alessandro D. Loguercio^*

^*Corresponding author for this work

Facultad de Odontología

Research output: Contribution to journal › Article › peer-review

7 Scopus citations

Abstract

Purpose: To evaluate how incorporating copper nanoparticles (CuNp) into a universal adhesive affects the antimicrobial activity (AMA), bond strength (μTBS), nanoleakage (NL), elastic modulus (EM) and nanohardness (NH) of resin–dentin interfaces, at 24 h (24 h) and after in situ cariogenic challenge (CC). Methods: CuNp (0% [control] and 0.1 wt%) was added to an adhesive. After enamel removal, the adhesives were applied to dentine surfaces. Each restored tooth was sectioned longitudinally to obtain two hemi-teeth; one of them was evaluated after 24 h, and the other was included in one of the intra-oral palatal devices placed in the mouths of 10 volunteers for 14 days in CC. After that, each hemi-tooth was removed, and any oral biofilm that formed was collected. The AMA was evaluated against Streptococcus mutans. For the 24 h and CC groups, each hemi-tooth was sectioned in the “x” direction to obtain one slice for each EM/NH evaluation. The remains of each hemi-tooth were sectioned in the “x” and “y" directions to obtain resin-dentin beams for μTBS and NL evaluation (24 h and CC). ANOVA and Tukey's test were applied (α = 0.05). Results: The presence of CuNp significantly improved AMA as well as all of the evaluated properties (24 h; p < 0.05). Although the adhesive properties (μTBS/NL) for all groups decreased after CC (p < 0.05), the adhesive containing CuNp showed higher μTBS and lower NL as compared to the copper-free adhesive (p < 0.05). The incorporation of CuNp maintained NH/EM values after CC (p < 0.05). Conclusions: Adding 0.1% CuNp to an adhesive may provide antimicrobial activity and increase its bonding and mechanical properties, even under a cariogenic challenge. Significance: This is the first in situ study proving that incorporating CuNp into an adhesive is an achievable alternative to provide antimicrobial properties and improve the integrity of the hybrid layer under in situ cariogenic challenge.

Original language	English
Article number	105017
Pages (from-to)	1-9
Number of pages	9
Journal	Journal of the Mechanical Behavior of Biomedical Materials
Volume	126
Early online date	2 Dec 2021
DOIs	https://doi.org/10.1016/j.jmbbm.2021.105017
State	Published - Feb 2022

Bibliographical note

Funding Information:
This study was performed by Omar Vidal as partial fulfillment of his Master of Science degree at the State University of Ponta Grossa (UEPG), Ponta Grossa, PR, Brazil. This work was partially supported by the National Council for Scientific and Technological Development (CNPq) [grant 308286/2019-7 ] and by Coordenação de Aperfeiçoamento de Pessoal de Nível Superior (CAPES) [Finance Code 001 ] (Brazilian agencies). The authors are grateful for the technical support of the interdisciplinary laboratory CLABMU of State University of Ponta Grossa. The authors would like to thanks to Mr. Juan Fernández de los Ríos, from the Language and Translation services, Direction of Academic Affairs, Faculty of Dentistry, Universidad de Chile, for kindly proofreading and checking the spelling and grammar of this article.

Funding Information:
This study was performed by Omar Vidal as partial fulfillment of his Master of Science degree at the State University of Ponta Grossa (UEPG), Ponta Grossa, PR, Brazil. This work was partially supported by the National Council for Scientific and Technological Development (CNPq) [grant 308286/2019-7] and by Coordena??o de Aperfei?oamento de Pessoal de N?vel Superior (CAPES) [Finance Code 001] (Brazilian agencies). The authors are grateful for the technical support of the interdisciplinary laboratory CLABMU of State University of Ponta Grossa. The authors would like to thanks to Mr. Juan Fern?ndez de los R?os, from the Language and Translation services, Direction of Academic Affairs, Faculty of Dentistry, Universidad de Chile, for kindly proofreading and checking the spelling and grammar of this article.

Publisher Copyright:
© 2021 Elsevier Ltd

Keywords

Copper
In situ
Microtensile bond strength
Nanoleakage
Nanoparticles
Universal adhesive system

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10.1016/j.jmbbm.2021.105017

Cite this

Vidal, O., de Paris Matos, T., Núñez, A., Méndez-Bauer, L., Sutil, E., Ñaupari-Villasante, R., Souta, M. C., Pitlovanciv, M., Gutiérrez, M. F., & Loguercio, A. D. (2022). A universal adhesive containing copper nanoparticles improves the stability of hybrid layer in a cariogenic oral environment: An in situ study. Journal of the Mechanical Behavior of Biomedical Materials, 126, 1-9. Article 105017. https://doi.org/10.1016/j.jmbbm.2021.105017

@article{506bdec2485f4d04853c77d3bc55b400,

title = "A universal adhesive containing copper nanoparticles improves the stability of hybrid layer in a cariogenic oral environment: An in situ study",

abstract = "Purpose: To evaluate how incorporating copper nanoparticles (CuNp) into a universal adhesive affects the antimicrobial activity (AMA), bond strength (μTBS), nanoleakage (NL), elastic modulus (EM) and nanohardness (NH) of resin–dentin interfaces, at 24 h (24 h) and after in situ cariogenic challenge (CC). Methods: CuNp (0% [control] and 0.1 wt%) was added to an adhesive. After enamel removal, the adhesives were applied to dentine surfaces. Each restored tooth was sectioned longitudinally to obtain two hemi-teeth; one of them was evaluated after 24 h, and the other was included in one of the intra-oral palatal devices placed in the mouths of 10 volunteers for 14 days in CC. After that, each hemi-tooth was removed, and any oral biofilm that formed was collected. The AMA was evaluated against Streptococcus mutans. For the 24 h and CC groups, each hemi-tooth was sectioned in the “x” direction to obtain one slice for each EM/NH evaluation. The remains of each hemi-tooth were sectioned in the “x” and “y{"} directions to obtain resin-dentin beams for μTBS and NL evaluation (24 h and CC). ANOVA and Tukey's test were applied (α = 0.05). Results: The presence of CuNp significantly improved AMA as well as all of the evaluated properties (24 h; p < 0.05). Although the adhesive properties (μTBS/NL) for all groups decreased after CC (p < 0.05), the adhesive containing CuNp showed higher μTBS and lower NL as compared to the copper-free adhesive (p < 0.05). The incorporation of CuNp maintained NH/EM values after CC (p < 0.05). Conclusions: Adding 0.1% CuNp to an adhesive may provide antimicrobial activity and increase its bonding and mechanical properties, even under a cariogenic challenge. Significance: This is the first in situ study proving that incorporating CuNp into an adhesive is an achievable alternative to provide antimicrobial properties and improve the integrity of the hybrid layer under in situ cariogenic challenge.",

keywords = "Copper, In situ, Microtensile bond strength, Nanoleakage, Nanoparticles, Universal adhesive system",

author = "Omar Vidal and {de Paris Matos}, Thalita and Alejandra N{\'u}{\~n}ez and Luj{\'a}n M{\'e}ndez-Bauer and Elisama Sutil and Romina {\~N}aupari-Villasante and Souta, {Melissa Caroline} and Murilo Pitlovanciv and Guti{\'e}rrez, {Mario F.} and Loguercio, {Alessandro D.}",

note = "Funding Information: This study was performed by Omar Vidal as partial fulfillment of his Master of Science degree at the State University of Ponta Grossa (UEPG), Ponta Grossa, PR, Brazil. This work was partially supported by the National Council for Scientific and Technological Development (CNPq) [grant 308286/2019-7 ] and by Coordena{\c c}{\~a}o de Aperfei{\c c}oamento de Pessoal de N{\'i}vel Superior (CAPES) [Finance Code 001 ] (Brazilian agencies). The authors are grateful for the technical support of the interdisciplinary laboratory CLABMU of State University of Ponta Grossa. The authors would like to thanks to Mr. Juan Fern{\'a}ndez de los R{\'i}os, from the Language and Translation services, Direction of Academic Affairs, Faculty of Dentistry, Universidad de Chile, for kindly proofreading and checking the spelling and grammar of this article. Funding Information: This study was performed by Omar Vidal as partial fulfillment of his Master of Science degree at the State University of Ponta Grossa (UEPG), Ponta Grossa, PR, Brazil. This work was partially supported by the National Council for Scientific and Technological Development (CNPq) [grant 308286/2019-7] and by Coordena??o de Aperfei?oamento de Pessoal de N?vel Superior (CAPES) [Finance Code 001] (Brazilian agencies). The authors are grateful for the technical support of the interdisciplinary laboratory CLABMU of State University of Ponta Grossa. The authors would like to thanks to Mr. Juan Fern?ndez de los R?os, from the Language and Translation services, Direction of Academic Affairs, Faculty of Dentistry, Universidad de Chile, for kindly proofreading and checking the spelling and grammar of this article. Publisher Copyright: {\textcopyright} 2021 Elsevier Ltd",

year = "2022",

month = feb,

doi = "10.1016/j.jmbbm.2021.105017",

language = "English",

volume = "126",

pages = "1--9",

journal = "Journal of the Mechanical Behavior of Biomedical Materials",

issn = "1751-6161",

publisher = "Elsevier BV",

}

Vidal, O, de Paris Matos, T, Núñez, A, Méndez-Bauer, L, Sutil, E, Ñaupari-Villasante, R, Souta, MC, Pitlovanciv, M, Gutiérrez, MF & Loguercio, AD 2022, 'A universal adhesive containing copper nanoparticles improves the stability of hybrid layer in a cariogenic oral environment: An in situ study', Journal of the Mechanical Behavior of Biomedical Materials, vol. 126, 105017, pp. 1-9. https://doi.org/10.1016/j.jmbbm.2021.105017

A universal adhesive containing copper nanoparticles improves the stability of hybrid layer in a cariogenic oral environment: An in situ study. / Vidal, Omar; de Paris Matos, Thalita; Núñez, Alejandra et al.
In: Journal of the Mechanical Behavior of Biomedical Materials, Vol. 126, 105017, 02.2022, p. 1-9.

Research output: Contribution to journal › Article › peer-review

TY - JOUR

T1 - A universal adhesive containing copper nanoparticles improves the stability of hybrid layer in a cariogenic oral environment

T2 - An in situ study

AU - Vidal, Omar

AU - de Paris Matos, Thalita

AU - Núñez, Alejandra

AU - Méndez-Bauer, Luján

AU - Sutil, Elisama

AU - Ñaupari-Villasante, Romina

AU - Souta, Melissa Caroline

AU - Pitlovanciv, Murilo

AU - Gutiérrez, Mario F.

AU - Loguercio, Alessandro D.

N1 - Funding Information: This study was performed by Omar Vidal as partial fulfillment of his Master of Science degree at the State University of Ponta Grossa (UEPG), Ponta Grossa, PR, Brazil. This work was partially supported by the National Council for Scientific and Technological Development (CNPq) [grant 308286/2019-7 ] and by Coordenação de Aperfeiçoamento de Pessoal de Nível Superior (CAPES) [Finance Code 001 ] (Brazilian agencies). The authors are grateful for the technical support of the interdisciplinary laboratory CLABMU of State University of Ponta Grossa. The authors would like to thanks to Mr. Juan Fernández de los Ríos, from the Language and Translation services, Direction of Academic Affairs, Faculty of Dentistry, Universidad de Chile, for kindly proofreading and checking the spelling and grammar of this article. Funding Information: This study was performed by Omar Vidal as partial fulfillment of his Master of Science degree at the State University of Ponta Grossa (UEPG), Ponta Grossa, PR, Brazil. This work was partially supported by the National Council for Scientific and Technological Development (CNPq) [grant 308286/2019-7] and by Coordena??o de Aperfei?oamento de Pessoal de N?vel Superior (CAPES) [Finance Code 001] (Brazilian agencies). The authors are grateful for the technical support of the interdisciplinary laboratory CLABMU of State University of Ponta Grossa. The authors would like to thanks to Mr. Juan Fern?ndez de los R?os, from the Language and Translation services, Direction of Academic Affairs, Faculty of Dentistry, Universidad de Chile, for kindly proofreading and checking the spelling and grammar of this article. Publisher Copyright: © 2021 Elsevier Ltd

PY - 2022/2

Y1 - 2022/2

N2 - Purpose: To evaluate how incorporating copper nanoparticles (CuNp) into a universal adhesive affects the antimicrobial activity (AMA), bond strength (μTBS), nanoleakage (NL), elastic modulus (EM) and nanohardness (NH) of resin–dentin interfaces, at 24 h (24 h) and after in situ cariogenic challenge (CC). Methods: CuNp (0% [control] and 0.1 wt%) was added to an adhesive. After enamel removal, the adhesives were applied to dentine surfaces. Each restored tooth was sectioned longitudinally to obtain two hemi-teeth; one of them was evaluated after 24 h, and the other was included in one of the intra-oral palatal devices placed in the mouths of 10 volunteers for 14 days in CC. After that, each hemi-tooth was removed, and any oral biofilm that formed was collected. The AMA was evaluated against Streptococcus mutans. For the 24 h and CC groups, each hemi-tooth was sectioned in the “x” direction to obtain one slice for each EM/NH evaluation. The remains of each hemi-tooth were sectioned in the “x” and “y" directions to obtain resin-dentin beams for μTBS and NL evaluation (24 h and CC). ANOVA and Tukey's test were applied (α = 0.05). Results: The presence of CuNp significantly improved AMA as well as all of the evaluated properties (24 h; p < 0.05). Although the adhesive properties (μTBS/NL) for all groups decreased after CC (p < 0.05), the adhesive containing CuNp showed higher μTBS and lower NL as compared to the copper-free adhesive (p < 0.05). The incorporation of CuNp maintained NH/EM values after CC (p < 0.05). Conclusions: Adding 0.1% CuNp to an adhesive may provide antimicrobial activity and increase its bonding and mechanical properties, even under a cariogenic challenge. Significance: This is the first in situ study proving that incorporating CuNp into an adhesive is an achievable alternative to provide antimicrobial properties and improve the integrity of the hybrid layer under in situ cariogenic challenge.

AB - Purpose: To evaluate how incorporating copper nanoparticles (CuNp) into a universal adhesive affects the antimicrobial activity (AMA), bond strength (μTBS), nanoleakage (NL), elastic modulus (EM) and nanohardness (NH) of resin–dentin interfaces, at 24 h (24 h) and after in situ cariogenic challenge (CC). Methods: CuNp (0% [control] and 0.1 wt%) was added to an adhesive. After enamel removal, the adhesives were applied to dentine surfaces. Each restored tooth was sectioned longitudinally to obtain two hemi-teeth; one of them was evaluated after 24 h, and the other was included in one of the intra-oral palatal devices placed in the mouths of 10 volunteers for 14 days in CC. After that, each hemi-tooth was removed, and any oral biofilm that formed was collected. The AMA was evaluated against Streptococcus mutans. For the 24 h and CC groups, each hemi-tooth was sectioned in the “x” direction to obtain one slice for each EM/NH evaluation. The remains of each hemi-tooth were sectioned in the “x” and “y" directions to obtain resin-dentin beams for μTBS and NL evaluation (24 h and CC). ANOVA and Tukey's test were applied (α = 0.05). Results: The presence of CuNp significantly improved AMA as well as all of the evaluated properties (24 h; p < 0.05). Although the adhesive properties (μTBS/NL) for all groups decreased after CC (p < 0.05), the adhesive containing CuNp showed higher μTBS and lower NL as compared to the copper-free adhesive (p < 0.05). The incorporation of CuNp maintained NH/EM values after CC (p < 0.05). Conclusions: Adding 0.1% CuNp to an adhesive may provide antimicrobial activity and increase its bonding and mechanical properties, even under a cariogenic challenge. Significance: This is the first in situ study proving that incorporating CuNp into an adhesive is an achievable alternative to provide antimicrobial properties and improve the integrity of the hybrid layer under in situ cariogenic challenge.

KW - Copper

KW - In situ

KW - Microtensile bond strength

KW - Nanoleakage

KW - Nanoparticles

KW - Universal adhesive system

UR - http://www.scopus.com/inward/record.url?scp=85120745757&partnerID=8YFLogxK

UR - https://www.mendeley.com/catalogue/14671b10-09d0-3ff7-b197-eb352e55d2d3/

U2 - 10.1016/j.jmbbm.2021.105017

DO - 10.1016/j.jmbbm.2021.105017

M3 - Article

AN - SCOPUS:85120745757

SN - 1751-6161

VL - 126

SP - 1

EP - 9

JO - Journal of the Mechanical Behavior of Biomedical Materials

JF - Journal of the Mechanical Behavior of Biomedical Materials

M1 - 105017

ER -

Vidal O, de Paris Matos T, Núñez A, Méndez-Bauer L, Sutil E, Ñaupari-Villasante R et al. A universal adhesive containing copper nanoparticles improves the stability of hybrid layer in a cariogenic oral environment: An in situ study. Journal of the Mechanical Behavior of Biomedical Materials. 2022 Feb;126:1-9. 105017. Epub 2021 Dec 2. doi: 10.1016/j.jmbbm.2021.105017

A universal adhesive containing copper nanoparticles improves the stability of hybrid layer in a cariogenic oral environment: An in situ study

Abstract

Bibliographical note

Keywords

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